Formulation design of a new type of epoxy resin-based insulating adhesive and research on its high temperature resistance

Abstract

A series of new epoxy resin adhesives were prepared by low viscosity bisphenol A epoxy resin E-44 and E-51as the matrix,  low molecular polyamide 650# and phenolic modified JT-3008 as the curing agent, silicon micro powder and calcium carbonate as the fillers. The gelation time, surface drying time and shear strength of the samples were deeply tested. The thermal decomposition temperature and high temperature resistance of the samples were determined by TG analysis. Meanwhile, the surface fracture morphology was observed by SEM. The results showed that a new kind of heat epoxy resin insulation adhesive with long gelation time and convenient construction and meeting the requirements of production adjustment was successfully obtained through the optimization design of the formula,. The new epoxy resin insulation adhesive showed excellent mechanical properties with 18.00 MPa shear strength, which can be used at 380 ℃ for a short period of time and 130 ℃ for a long time.  The new adhesive developed in this paper can be widely used in high voltage switchgear and other insulation materials, which has good application prospects.