Characteristic analysis and simulation of a Cu-graphene hybrid nanointerconnect under different Drude models

Abstract

It is well known that the ultra thin barrier layer around the Cu nanointerconnect has a great impact on its performance. Currently, graphene is the thinnest two-dimensional material. Cu-graphene hybrid nanointerconnects can significantly advance the potential of integrated cirCuit technology. In this article, we put a monolayer graphene on the top, left and right sides of a Cu nanointerconnect. graraphene adopts three Drude models, namely, the Drude model obtained by simplified Kubo formula, the Drude-Lorentz model, and the Drude model derived from Boltzmann equation. We use cst to simulate the voltage-current variation and propagation delay characteristics of a Cu-graphene hybrid nanointerconnect are observed under three Drude models and compared with a Cu nanointerconnect. Finally, the Drude model of graphene which is derived from the Boltzmann transport equation can minimize the voltage of the Cu nanointerconnect and reduce the propagation delay of the two ports of the Cu nanointerconnect.